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FEP Polyimide Film

FEP Polyimide Film is made from base polyimide film coated by F46(Fep) resin on one side(FH) or double sides ( FHF) through baking under high temperature. As a result, it not only has the good properties of PI film, but also heat-sticking.

Characters:

* Class H insulation and heat resistance

* Excellent dielectric performance.

*Higher mechanical strength, better tear resistance and flexibility.

*Seif-sticking through heating

Spec.:

Type	FH	FHF
Thickness mm	0.0375-0.12±8%	0.04-0.12±8%
Standard Width mm	500	500
Supply size	Supplied in rolls, core diameter: 76mm.

Лcustomization can also be available.

Typical Properties (The follows are just examples not read as guaranteed values)

Property items	Units	FH	FHF
1. Visual	The surface should be even and free from wrinkle, blister, adhesive particle impurity.
2.Tensile strength	MPa	≥100	≥100
3. Elongation		≥40	≥40
4. Dielectric strength	kV/mm	≥150	≥150
5. Vol. Resistivity,	Ω.m	≥1x 10¹⁰	≥1 x 10¹⁰
6. Dielectric constant		3-4	3-4
7.Dielectric dissipation factor		≤1.0×10^-3	≤1.0×10^-3
8. Peel strength	N/cm	≥2.3	≥2.3

Storage:

The product is packed in reinforced carton and sealed by plastic film bag. Please keep dry and in room temperature. Shelf life is 12 months.

Applications:

Fep polyimide film is widely used in electromagnetic wire, high temperature-resisting wire for electrical insulation, and other fields needing PI self-sticking through heating

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