Polyimide Bondply
Polyimide Bondply is made of polyimide film coated by modified stage-B acrylic adhesive on two sides with
protection release film or paper. Polyimide bondply is widely used in protection of FCPB and other fields.
Characters:
* Excellent dielectric performance, high bondability and good dimension stability
* Low fluidity and good processability.
*Supplied with different sizes and colors.
Spec.:
|
Models AD/PI/AD (AD=adhesive;PI=polyimide film) |
Unit |
25/25/25 |
50/25/50 |
25/50/25 |
50/50/50 |
25/75/25 |
|
Typical total Thickness |
mm±10% |
0.075 |
0.125 |
0.10 |
0.15 |
0.125 |
|
Film Thickness |
mm |
0.025(1 mil) |
0.025(1 mil) |
0.05(2mil) |
0.05(2mil) |
0.075(3mil) |
|
Adhesive thickness per side |
mm |
0.025 |
0.05 |
0.025 |
0.05 |
0.025 |
|
Nominal Weight(Film and adhesive) |
g/㎡±10% |
100 |
170 |
130 |
205 |
170 |
|
Supply Size and Packing |
Standard roll: 50㎡ per roll,width:500mm Carton after winded up into log roll and sealed by plastic film bag, Core ID:3" |
|||||
Лcustomization can also be available.
Typical Properties( The follows are just examples not read as guaranteed values)
|
Items |
Unit |
Test Method |
Typical datas |
|
1. Peel Strength -As normal conditions -After soldering |
N/mm--width |
IPC-TM-650-2.4.9 |
1.5 1.5 |
|
2. Dimensional Stability |
% |
IPC-TM-650-2.2.4A |
0.10 |
|
3. Adhesive Flow |
um |
IPC-TM-650-2.3.17.1 |
<150 |
|
4. Volatile Content |
% |
IPC-TM-650-2.3.37 |
≤3.0 |
|
5. Soldering resistance |
288℃/10sec. |
IPC-TM-650-2.4.13 |
Pass |
|
6. Moisture Absorption |
% |
IPC-TM-650-2.6.2 |
≤4.0 |
|
7. Dielectric strength |
KV/mm |
ASTM-D-149 |
≥50 |
|
8. Chemical resistance |
% |
IPC-TM-650-2.3.2 |
≥80 |
|
9. Dielectric constant |
MHZ |
IPC-TM-650-2.5.5.3 |
≤4.0 |
|
10.Dissipation factor |
----- |
IPC-TM-650-2.5.5.3 |
≤0.04 |
|
11. Volume resistivity |
MΩ-cm |
IPC-TM-650-2.5.17 |
108 |
|
12. Surface resistivity |
MΩ |
IPC-TM-650-2.5.17 |
106 |
Storage:The product is packed in reinforced carton and sealed in plastic film bag. Please keep dry and in room temperature. Shelf life is 12 months.
Application:Polyimide Bondply is mainly used in protection of flexible printed circuit board and other relevant fields.
Note: 1.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
2.Please contact us if customization requirements.