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PIR-002 polyimide resin powder is unfilled thermal plastic polyimide with ODPA/ODA structure, widely used as matrix resin for shapes,components and parts with excellent physical properties,especially on flexibility due to its ether bond.
Note:1.Different polyimide types also available with different structures
2.ODPA/ODA abbr. of 4,4'-Oxydiphthalic anhydride/ 4,4'-Oxydianiline
Base structure:
Typical Properties(The follows are just examples not read as guaranteed values)
| Items | Test methods | Units | Typical Value |
| 1.Visual | Light yellow for unfilled one | ||
| 2.Tensile strength 23℃ | ASTM/D1708 | MPa | 90 |
| 3. Elongation | ASTM/D1708 | % | 6.5 |
| 4.Flextural strength 23℃ | ASTM/D790 | Mpa | 105 |
| 5.Flextural Modulus 23℃ | ASTM/D790 | Mpa | 2900 |
| 6.Izod unnotched impact 23℃ | IEC179 | KJ/m² | 175 |
| 7.Compressive strength 23℃ 10% strain | ASTM/D695 | MPa | 110 |
| 8. Vol. Resistivity | ASTM/D257 | Ω.m | > 1 x 1014 |
| 9. Surface Resistivity, | ASTM/D257 | Ω | > 1 x 1015 |
| 10.Dielectric constant | ASTM/D150 | 2.5--3.0 | |
| 11.Coefficient of linear expansion nnsexpansion | ASTM/D696 | 10-5cm/cm/℃ | 4.5 |
| 12.Friction coefficient | GB3960 | 0.3 | |
| 13.Thermal loss (300℃) | TGA | % | Less 0.5% |
| 14. Glass transition temp. Tg | DSC204/1/F | ℃ | 260 |
| 15. Specific Gravity | ASTM/D1505 | 1.4 | |
Packing: carton after sealed by plastic film bag Shelf life: 2 Years
Note: 1.Since polyimide resins are hygroscopic, please predried at 250 °F (120 °C) for a couple of hours before any use
2.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
3.Please contact us if customization requirements.
Contact information:
Company: WJF Chemicals Co. Ltd. QuZhou (website: www.wjfchemicals.com)
Address: 601 ZhongXing Plaza No. 123 HeHua ZhongLu QuZhou ZheJiang Province China
Email: info@wjfchemicals.com ; jeffeywang@hotmail.com
Tel./Fax: +865703865831 Mob.:+8613059765326(we chat)
