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PIR-005 polyimide resin powder is unfilled polyimide with PMDA/ODA structure,Tg over 400℃, widely used as matrix resin for shapes,components and parts with excellent physical properties, that can work under harsh conditions due to its strong structure.
Note:1.Different polyimide types also available with different structures
2.PMDA/ODA abbr. of pyromellitic anhydride/4,4'-Oxydianiline
Base Structure:
Characters:
* Good compatibility with fillers:graphite,glass fiber,PTFE,MoS2,etc.
* Low wear and friction * Excellent heat resistance.
* Excellent dielectric performance. * Excellent chemical resistance.
*Higher mechanical strength, better tear resistance. *Machinable with standard tools
Typical Properties( The follows are just examples not read as guaranteed values)
| Items | Test methods | Units | Typical Value |
| 1.Visual | Light amber for unfilled one | ||
| 2.Tensile strength 23℃ | ASTM/D1708 | MPa | 80 |
| 3. Elongation | ASTM/D1708 | % | 6.5 |
| 4.Flextural strength 23℃ | ASTM/D790 | Mpa | 90 |
| 5.Flextural Modulus 23℃ | ASTM/D790 | Mpa | 2800 |
| 6.Unnotched impact strength 23℃ | ISO179 | KJ/m² | 80 |
| 7.Compressive strength 23℃ 10% strain | ASTM/D695 | MPa | 105 |
| 8. Vol. Resistivity | ASTM/D257 | Ω.m | > 1 x 1014 |
| 9. Surface Resistivity, | ASTM/D257 | Ω | > 1 x 1015 |
| 10.Dielectric constant | ASTM/D150 | 2.5--3.0 | |
| 11.Coefficient of linear expansion nnsexpansion | ASTM/D696 | 10-5cm/cm/℃ | 4.5 |
| 12.Friction coefficient | GB3960 | 0.25-0.3 | |
| 13.Glass transition temp. Tg | DSC204/1/F | ℃ | Over 400 |
| 14. Specific Gravity | ASTM/D1505 | 1.42 | |
Packing: carton after sealed by plastic film bag Shelf life: 2 Years
Note: 1.Since polyimide resins are hygroscopic, please predried at 250 °F (120 °C) for a couple of hours before any use
2.All of above information is based on our best knowledge, not read as guarantees. Right reserved for corrections.
3.Please contact us if customization requirements.
